Hulp nodig?

MMIX1F210N30P3

Our proven Technology

Ultra-low and compact package profile. Surface mountable via standard reflow process. Low package weight. Low package inductance. Excellent thermal performance. High power cycling capability. Battery chargers. Switching and resonant power supplies. Dc-dc converters. Temperature and Lighting controls. Motor drives. E-bikes and electric and hybrid vehicles. Solar inverters. Induction heaters.

SKU: MMIX1F210N30P3Categories: MOSFETs (Si/SiC)

Specifications

Gewicht 0.008 kg
Weight (g)

8

Fast Intrinsic Rectifier

Up to 4.5 kV ceramic isolation (DCB)

AC and DC Motor Drives

Dc choppers

Package Type

SMPD

Business Group

POWER SEMI

Product Line

MULTICHIP

Cont. Drain Curr. 25C (A)

108

Drain Source (V)

300

Gate Charge (nC)

268

Input Capacitance CISS (pF)

16200

Max On-Resistance 25C (Ohm)

0.016

Max Reverse Recovery (ns)

250

Power Dissipation (W)

520

Rth (j-c) (K/W)

0.24

Voltage (V)

300

Current (A)

108

Features and benefits

Weighing only 8g, the SMPD package is much lighter (typically by 50%) than comparable conventional power modules, thereby enabling lower weight power systems. Due to its compact and ultra-low profile package, it is possible to use the same heat sink for multiple devices, saving PCB space. An added benefit of being smaller and lighter is that it provides better protection against vibrations and g-forces, especially if used in portable appliances, increasing the life expectancy and reliability of these devices.
Configurations:

Buck
Boost
Full-bridge
Half-bridge
Phase leg
Single

More information and download request

For more information, access to the product datasheet, or to get in touch with one of our specialists. Please fill out the form below.

Thank you for your request

The datasheet is available below. We will respond to your request promptly.

Plan een korte technische online meeting