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MMIX2F94N30T

Our proven Technology

Ultra-low and compact package profile. Surface mountable via standard reflow process. Low package weight. Low package inductance. Excellent thermal performance. High power cycling capability. Battery chargers. Switching and resonant power supplies. Dc-dc converters. Temperature and Lighting controls. Motor drives. E-bikes and electric and hybrid vehicles. Solar inverters. Induction heaters.

SKU: MMIX2F94N30TCategories: MOSFETs (Si/SiC)

Specifications

Fast Intrinsic Rectifier

Up to 4.5 kV ceramic isolation (DCB)

AC and DC Motor Drives

Dc choppers

Package Type

SMPD

Cont. Drain Curr. 25C (A)

52

Drain Source (V)

300

Gate Charge (nC)

190

Input Capacitance CISS (pF)

11400

Max On-Resistance 25C (Ohm)

0.04

Max Reverse Recovery (ns)
Power Dissipation (W)

305

Rth (j-c) (K/W)

0.41

Typ Rev Recov Time(ns)

155

Voltage (V)

300

Current (A)

52

Features and benefits

Weighing only 8g, the SMPD package is much lighter (typically by 50%) than comparable conventional power modules, thereby enabling lower weight power systems. Due to its compact and ultra-low profile package, it is possible to use the same heat sink for multiple devices, saving PCB space. An added benefit of being smaller and lighter is that it provides better protection against vibrations and g-forces, especially if used in portable appliances, increasing the life expectancy and reliability of these devices.
Configurations:

Buck
Boost
Full-bridge
Half-bridge
Phase leg
Single

More information and download request

For more information, access to the product datasheet, or to get in touch with one of our specialists. Please fill out the form below.

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The datasheet is available below. We will respond to your request promptly.
Download file: MMIX2F94N30T_datasheet

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