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MMIX1F44N100Q3

Our proven Technology

Ultra-low and compact package profile. Surface mountable via standard reflow process. Low package weight. Low package inductance. Excellent thermal performance. High power cycling capability. Battery chargers. Switching and resonant power supplies. Dc-dc converters. Temperature and Lighting controls. Motor drives. E-bikes and electric and hybrid vehicles. Solar inverters. Induction heaters.

SKU: MMIX1F44N100Q3Categories: MOSFETs (Si/SiC)

Specifications

Weight 0.008 kg
Weight (g)

8

Fast Intrinsic Rectifier

Up to 4.5 kV ceramic isolation (DCB)

AC and DC Motor Drives

Dc choppers

Package Type

SMPD

Business Group

POWER SEMI

Product Line

MULTICHIP

Cont. Drain Curr. 25C (A)

30

Drain Source (V)

1000

Gate Charge (nC)

264

Input Capacitance CISS (pF)

13600

Max On-Resistance 25C (Ohm)

0.245

Max Reverse Recovery (ns)

300

Power Dissipation (W)

694

Rth (j-c) (K/W)

0.18

Voltage (V)

1000

Current (A)

30

Features and benefits

Weighing only 8g, the SMPD package is much lighter (typically by 50%) than comparable conventional power modules, thereby enabling lower weight power systems. Due to its compact and ultra-low profile package, it is possible to use the same heat sink for multiple devices, saving PCB space. An added benefit of being smaller and lighter is that it provides better protection against vibrations and g-forces, especially if used in portable appliances, increasing the life expectancy and reliability of these devices.
Configurations:

Buck
Boost
Full-bridge
Half-bridge
Phase leg
Single

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