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Embedded tube heatsink LCP 180×20 – ET 4 Pass

Our proven Technology

SKU: LCP 180x20 - ET 4 PassCategories: Liquid cooled plates

Specifications

Dimensions 180 × 20 mm
Brand

MeccAL

Product type

Embedded tube heatsink

Product series

Serie LCP-ET

Cooling

Liquid cooling

Base plate material

20mm thick, Al EN AW-6082

Tube size

Cu 10 x 1.5mm

Liquid requirement

H2O, Tin 40°C

Power dissipation

2 kW, 4 kW

Features and benefits

Using copper, stainless steel and aluminum tubes, pressed in base plates made from Mecc.Al’s own in-house manufactured aluminum alloys, MeccAl designs and manufactures an unlimited number of custom solutions for each individual project requirement. The range also offers a series of plates with established dimensions usable for simpler applications already sized to include almost all the commercially available active components. Custom design: Mecc.Al can design embedded tube LCPs to be fully customized for the individual needs of each specific design, regardless of the application for which the plate is designed.

Aluminum alloys produced in our factory with different thermal and mechanical charateristics can be combined with extruded or electro-welded copper, stainless steel, and aluminum tube coils of all diameters and thicknesses, and fitted with connectors of all types both outside and inside the plate perimeter. We form the tube coils with a specific shape that maximizes both the tube adhesion and the size of the contact area between the heat sources and the tube itself. The tubes are mechanically assembled to the base plate using specific tools for each geometry, and high pressure hydraulic presses. The Mecc.Al exclusive section shape, pressed in the base plates without glues or resins, maximizes adhesion and minimizes any thermal impedance between the tube coil and the plate, both on the straight and curved parts of the design.

Different geometries in the construction of the base plate and the tube coil allow us to localize and concentrate the best dissipation performance in areas of the plate where the most critical interfaces are positioned, leading to optimised thermal conductivity, minimized mechanical and electrochemical resistance, and reduced overall costs.

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