Our Surface Mount Power Device (SMPD) packaging technology is an expansion of the ISOPLUS™ package portfolio to include modules that can be assembled in standard surface mount (SMD) soldering processes and is pick-and-place ready to be assembled on a customer’s existing SMD assembly lines.
Our SMPD range provides a large array of standard options in terms of topology or silicon varieties. Its simplicity and optimized manufacturing process enables fast time to market for customers that require differing die and circuit combinations effectively fast tracking product development. Numerous discrete devices can be successfully combined in one high reliability package that can then be easily assembled on current SMD assembly lines.
MMIX1Y100N120C3H1
Our proven Technology
Disc IGBT SMPD Pkg-Standard SMPD-B. Ultra-low and compact package profile. Surface mountable via standard reflow process. Low package weight. Up to 4.5 kV ceramic isolation (DCB). Low package inductance. Excellent thermal performance. High power cycling capability. Battery chargers. Switching and resonant power supplies. Dc choppers. Dc-dc converters. Temperature and Lighting controls. Motor drives. E-bikes and electric and hybrid vehicles. Solar inverters. Induction heaters
Specifications
| Weight | 0.008 kg |
|---|---|
| Weight (g) | 8 |
| Voltage (V) | 3.5 |
| Current (A) | 92 |
| Product line | MULTICHIP |
| Package Type | SMPDU |
| Current at 100C - 110C (A) | |
| Current at 25C (A) | |
| Emitter Saturation (V) | |
| Fall Time Induct. Load (ns) | |
| Thermal Res. Diode (kW) | |
| Thermal Res. IGBT (kW) | |
| VCES Collector-Emitter (V) |
Features and benefits
More information and download request
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Download file: MMIX1Y100N120C3H1_datasheet